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  1. Techstar Innovations specialises in Gold Wire Bonder, Die Bonder, Flip chip Bonder, Aluminium Wire Wedge Bonder, Gold Bonding Wire, BGA Solder Sphere Ball, ...

    A specialist in semiconductor Gold Wire Bonder, Die Bonder, Flip Chip Bonder, Gold Bonding Wire, BGA Solder Sphere Ball, Aluminium Wire Wedge Bonder, Auto ...
    aluminium wedge bonder0
    aluminium wire wedge bonder0
    bga solder ball0
    bga solder sphere.0
    bga solder sphere ball0
    die bondings0
    Flip Chip Bonders0
    Flip Chip Bondings0
    gold wire bonder0
    lead frame inspection0
    Leadframe Inspection0
    semiconductor wire bonders0
    semiconductor wire bondings0
    ultra fine pitch wire bonders0
    ultra fine pitch wire bonding0
    Wire Bondings0

    www.techstar-i.com - 2009-02-07
  2. Component Technology Pte Ltd

    Component Technology is an authorized distributor and representative for several companies in Singapore, Malaysia, Indonesia and Thailand dealing with ...
    CT- XRay0
    IN51000
    In.D Scope0
    PCB Inspection & Measurement0
    Pine Valley Precision0
    Semiconductor Equipments0
    TDI International0
    TOSOK0
    XYZTEC0
    XYZTEC Precision Technology0

    www.cthelp.com - 2009-02-05

pine valley precision0 ivi1 die bonder1 semiconductor equipment1 flip chip1 bga1 pcb inspection & measurement0 optilia1

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